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INTEGRATED CIRCUITS
SA57001-XX Microminiature, low power consumption, low dropout regulator
Product data File under Integrated Circuits, Standard Analog 2001 Aug 01
Philips Semiconductors
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
GENERAL DESCRIPTION
The SA57001-XX is a series of micro-miniature linear regulators providing fixed output voltages with a precision accuracy of 2% at output currents up to 200 mA. The regulator is designed to serve as a post regulator in microprocessor power supplies. The device has an ON/OFF pin for output On/Off control, and a Noise pin which can be used to bypass the internal voltage reference node for enhanced noise reduction. The SA57001 has a dropout voltage of only 0.1 V (typical) while delivering 50 mA of output current. The maximum no load quiescent current is less than 190 A in the ON state. The device has thermal shutdown and output current limiting circuits to prevent damage from overheating and short circuits. The SA57001 regulator series is available in the SOT23-5 package.
FEATURES
* No load quiescent current of 0.95 A * 0.1 V typical (IO = 50 mA) dropout voltage * 70 dB typical ripple rejection * 150 mA maximum output current * 35 Vrms (typical) * Preset output voltages of 2.0, 2.5, 2.8, 3.0, 3.1, 3.3, 3.6, 4.5, 4.8,
5.0 V available
APPLICATIONS
* Cordless phones * Portable minidiscs * Other battery-operated equipment.
* Output current limiting * Thermal shutdown protection * Output ON/OFF control.
SIMPLIFIED SYSTEM DIAGRAM
VIN 5 THERMAL PROTECT DRIVER ON/OFF 1 COUT 4.7 F (ALUMINUM ELECTROLYTIC) 4 VOUT OUTPUT (2%)
CURRENT LIMIT
NOISE 3 VREF 0.01 F CERAMIC (OPTIONAL) 2 GND
SA57001-XX
SL01418
Figure 1. Simplified system diagram.
2001 Aug 01
2
853-2274 26807
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
ORDERING INFORMATION
PACKAGE TYPE NUMBER SA57001-XXGW NAME SOT23-5, SOT25, SO5 DESCRIPTION plastic small outline package; 5 leads (see dimensional drawing) TEMPERATURE RANGE -40 to +85 C
NOTE: The device has ten voltage output options, indicated by the XX on the Type Number. XX 20 25 28 30 31 33 36 45 48 50 VOLTAGE (Typical) 2.0 V 2.5 V 2.8 V 3.0 V 3.1 V 3.3 V 3.6 V 4.5 V 4.8 V 5.0 V
Part number marking
Each package is marked with a four letter code. The first three letters designate the product. The fourth letter, represented by `x', is a date tracking code. Part number SA57001-20 SA57001-25 SA57001-28 SA57001-30 SA57001-31 SA57001-33 SA57001-36 SA57001-45 SA57001-48 SA57001-50 Marking ADKx AMFx ADJx ADGx ADFx ADEx ADHx ADDx ADLx ADCx
PIN CONFIGURATION
PIN DESCRIPTION
PIN SA57001-XX SYMBOL ON/OFF GND NOISE DESCRIPTION Output ON/OFF control pin. Circuit ground pin. Provides option of externally bypassing the internal voltage reference node for enhanced noise reduction. Voltage regulator output. Input supply voltage to regulator. 1 2 3
4 VOUT
ON/OFF
1
5
VIN
GND
2
NOISE
3
4
SA00617
VOUT VIN
5
Figure 2. Pin configuration.
MAXIMUM RATINGS
SYMBOL VIN Toper Tj Tstg PD Rth(j-a) VESD1 VESD2 Tsolder Input supply voltage Operating ambient temperature range Operating junction temperature Storage temperature Power dissipation Thermal resistance from junction to ambient ESD damage threshold (Human Body Model); Note 1 ESD damage threshold (Machine Model); Note 2 Soldering temperature; Note 3 PARAMETER MIN. -0.3 -20 - -40 - - - - - MAX. 12 +75 t.b.d. +125 150 t.b.d. 2000 200 230 UNIT V C C C mW C/W V V C
NOTES: 1. Performed in accordance with Human Body Model (CZap = 100 pF, RZap = 1500 ). 2. Performed in accordance with Machine Model (CZap = 100 pF, RZap = 0 ). 3. 60 second maximum exposure for SMD Reflow temperatures above 183 C. 2001 Aug 01 3
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
DC ELECTRICAL CHARACTERISTICS
Tamb = 25 C, unless otherwise specified. SYMBOL VOUT ILIM IQ1 IQ2 VIN - VOUT Regline Regload TCVo RR Vn PARAMETER Output voltage Output current limit Quiescent current (circuit ON) Quiescent current (circuit OFF) Dropout voltage (Note 1) Line regulation Load regulation Temperature coefficient of output voltage Ripple rejection ratio Output noise voltage VIN = VOUT + 1.0 V; ON/OFF = VIN; IOUT = 0 mA VIN = VOUT + 1.0 V; ON/OFF = 0 V VIN = VOUT + 0.2 V; IOUT = 50 mA VOUT + 1.0 V VIN VOUT + 10 V; IOUT = 50 mA VIN = VOUT + 1.0 V; 0 mA IOUT 100 mA -20 C Tj 75 C; VIN = VOUT + 1.0 V; IOUT = 30 mA VIN = VOUT + 1.0 V; IOUT = 30 mA; VIN(Ripple) = 1.0 VP-P; f = 120 Hz VIN = VOUT + 1.0 V; IOUT = 30 mA; 20 Hz f 80 kHz; Cn = 0.01 F VON/OFF = 1.6 V CONDITIONS VIN = VOUT + 1.0 V; IOUT = 30 mA MIN. VOUT - 2.0% 200 - - - - - - 50 - TYP. VOUT 240 95 - 0.1 10 30 100 70 35 MAX. VOUT + 2.0% - 190 0.1 0.2 20 60 - - - UNIT V mA A A V mV mV V/C dB Vrms
ION/OFF VON/OFF(H) VON/OFF(L) TLIM
ON/OFF input current ON/OFF threshold (logic HIGH) ON/OFF threshold (logic LOW) Thermal shutdown
- 1.6 -0.3 -
5.0 - - 125
10 VIN - 0.3 V 0.4 -
A V V C
NOTE: 1. Dropout voltage is a measure of the minimum input/output differential voltage at the specified output current.
2001 Aug 01
4
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
TYPICAL PERFORMANCE CURVES
10 VOUT , OUTPUT VOLTAGE CHANGE (mV) IOUT - 30 mA ON/OFF = VIN = VOUT + 1.0 V Tamb = 25 C 5.0 400 PCB MOUNTED DEVICE (60 x 40 1.6 mm) P, POWER DISSIPATION (mW) 300
VOUT
200 UNMOUNTED DEVICE
-5.0
100
-10
4.0
6.0
8.0 VIN, INPUT VOLTAGE (V)
10
12
0 -50
-25
0
25
50
75
100
125
Tamb, TEMPERATURE (C)
SL01399
SL01400
Figure 3. Normalized line regulation versus input voltage.
Figure 4. Power dissipation versus temperature.
2.0 No output load ON/OFF = VIN Tamb = 25 C 1.5 Typical 5.0 V Device 1.0 Typical 3.0 V Device Typical 2.0 V Device 0.5
9.0 8.0 I Q(on) , GROUND CURRENT (mA) 7.0 6.0 5.0 4.0 3.0 2.0 1.0 VIN = VOUT + 1.0 V ON/OFF = VIN Tamb = 25 C
I Q1, QUIESCENT CURRENT (mA)
0
0 0 2.0 4.0 6.0 8.0 10 12 0 20 40 60 80 100 120 140 160 VIN, INPUT VOLTAGE (V) IOUT, OUTPUT CURRENT (mA)
SL01401
SL01402
Figure 5. Quiescent current versus input voltage.
Figure 6. Ground current versus output current.
300 VIN - V OUT, DROPOUT VOLTAGE (mV) ON/OFF = VIN = VOUT + 1.0 V Tamb = 25 C 250 VOUT, OUTPUT VOLTAGE (V)
3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 40 80 120 160 200 0 50 100 150 200 250 300 IOUT, OUTPUT CURRENT (mA) IOUT, OUTPUT CURRENT (mA) Shown for VOUT = 3.0 V device ON/OFF = VIN = VOUT + 1.0 V Tamb = 25 C
200
150
100
50
0
SL01403
SL01404
Figure 7. Dropout voltage versus output current.
Figure 8. Typical output current limit.
2001 Aug 01
5
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
1000
RR, RIPPLE REJECTION RATIO (dB)
0 V VIN 12 V COUT = 47 F Tamb = 25 C
-10 UNSTABLE REGION -20 -30 -40 -50 -60 -70 -80 -90 VIN = VOUT + 1.0 V VOUT(ripple) = 1.0 VP-P COUT = 47 F IOUT - 30 mA Tamb = 25 C
ESR, ESR @ 100 kHz ( )
100
10
STABLE REGION
1.0 UNSTABLE REGION 0.1 0.01
0.1
1.0
10
100
10
100
1.0k
10k
100k
1.0M
IOUT, OUTPUT CURRENT (mA)
f(ripple), RIPPLE FREQUENCY (Hz)
SL01411
SL01408
Figure 9. ESR stability versus output current.
Figure 10. Ripple rejection ratio versus frequency.
100 VOUT , OUTPUT VOLTAGE CHANGE (mV) Vn , OUTPUT NOISE VOLTAGE ( Vrms ) VIN = VOUT + 1.0 V IOUT = 30 mA COUT = 47 F Tamb = 25 C
20 10 VOUT -10 -20 -30 -40 -50 0.01 Cn, NOISE BYPASS CAPACITANCE (F) 0.1 0 40 80 120 160 200 IOUT, OUTPUT CURRENT (mA) VIN = VOUT + 1.0 V ON/OFF = VIN COUT = 47 F Tamb = 25 C
80
60
40
20
0 0.001
SL01410
SL01406
Figure 11. Output noise versus noise capacitance.
Figure 12. Normalized load regulation.
5.075 5.050 VOUT, OUTPUT VOLTAGE (V) 5.025 5.000 4.975 4.950 VIN = 6.0 V Typical 5.0 V VOUT device ON/OFF = VIN IOUT = 30 mA I Q2 , QUIESCENT CURRENT (mA)
0.6 Typical for 2.0 V VOUT 5.0 V devices VIN = VOUT + 1.0 V ON/OFF = 0 V (Output OFF) IOUT = 0 mA
0.4
0.2
2.050 2.025 2.000 1.075 -50 -25 0 25 50 75 100 125 VIN = 3.0 V Typical 2.0 V VOUT device
0
-0.2 -50 -25 0 25 50 75 100 125 Tamb, TEMPERATURE (C)
Tamb, TEMPERATURE (C)
SL01409
SL01405
Figure 13. Output voltage versus temperature.
Figure 14. Quiescent current versus temperature.
2001 Aug 01
6
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
200 180 I Q1, QUIESCENT CURRENT ( A) 160 140 120 100 80 60 -50
VIN - V OUT, DROPOUT VOLTAGE (mV)
Typical for 2.0 V VOUT 5.0 V devices VIN = VOUT + 1.0 V ON/OFF = VIN (Output ON) IOUT = 0 mA
250
200
Typical for 2.0 V VOUT 5.0 V devices VIN = VOUT + 0.2 V ON/OFF = VIN (Output ON) IOUT = 60 mA
150
100
50
-25
0
25
50
75
100
125
0 -50
-25
0
25
50
75
100
125
Tamb, TEMPERATURE (C)
Tamb, TEMPERATURE (C)
SL01413
SL01412
Figure 15. Quiescent current versus temperature.
Figure 16. Dropout voltage versus temperature.
40 VOUT , OUTPUT VOLTAGE CHANGE (mV) 30
I ON/OFF, ON/OFF CURRENT ( A)
Typical for 2.0 V VOUT 5.0 V devices VOUT + 1.0 V VIN VOUT + 10 V ON/OFF = VIN (Output ON) IOUT = 30 mA
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -50
Typical for 2.0 V VOUT 5.0 V devices VIN = VOUT + 1.0 V ON/OFF = 0.4 V
20
10
0
-10
-20 -50 -25 0 25 50 75 100 125 Tamb, TEMPERATURE (C)
-25
0
25
50
75
100
125
Tamb, TEMPERATURE (C)
SL01407
SL01414
Figure 17. Line regulation versus temperature.
Figure 18. ON/OFF current versus temperature.
10 D V2, OUTPUT VOLTAGE CHANGE (mV)
0 VOUT -10
I ON/OFF, ON/OFF CURRENT ( A)
VIN = VOUT + 1.0 V ON/OFF = VIN (Output ON) 0 mA IOUT 100 mA COUT = 47 F
5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 -50
Typical for 2.0 V VOUT 5.0 V devices VIN = VOUT + 1.0 V ON/OFF = 1.6 V
Typical 2.0 V device
-20
Typical 5.0 V device -30 -50 -25 0 25 50 75 100 125 -25 0 25 50 75 100 125
Tamb, TEMPERATURE (C)
Tamb, TEMPERATURE (C)
SL01416
SL01415
Figure 19. Load regulation variance versus temperature.
Figure 20. ON/OFF pin current versus temperature.
2001 Aug 01
7
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
2.0 1.8 1.6 HYSTERESIS 1.4 1.2 1.0 0.8 0.6 -50 -25 0 25 50 75 100 125 Tamb, TEMPERATURE (C) VON/OFF (HIGH) (VOUT VOUT - 2% VON/OFF (LOW) (IIN 0.1 A) Typical for 2.0 V VOUT 5.0 V devices VIN = VOUT + 1.0 V
VON/OFF, ON/OFF THRESHOLD (V)
SL01417
Figure 21. ON/OFF threshold versus temperature.
2001 Aug 01
8
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
TECHNICAL DESCRIPTION
The SA57001 is a family of series regulators incorporating a bandgap reference, two feedback amplifiers, a thermal shutdown circuit, and an output current limiting circuit. Both feedback amplifiers are referenced to the bandgap reference. See the device diagram shown in Figure 22. A PNP transistor in the device's output serves as the series pass element. The output PNP pass transistor incorporates a dual collector. The first feedback amplifier monitors the first collector's output voltage through the use of a voltage divider network fed directly from the output. The second collector produces a small current that is proportional to the output current. The proportional current flows through a resistor, generating a second feedback voltage that is proportional to the output current. This voltage is fed to the second feedback amplifier to limit the output current to a safe operating level. Both feedback amplifiers act on the same control node, to control the PNP pass transistor's conduction. This dual path output monitoring maintains a constant output voltage while also limiting the output current.
capacitors are smaller than electrolytic capacitors of the same capacitance value. Tantalum capacitors also are not prone to dry-out. The electrolyte used in electrolytic capacitors tends to dry out with time, degrading the performance. Avoid using extremely low ESR film or ceramic capacitors to avoid instability problems. See Figure 9, `ESR stability versus output current'. Keep in mind that the output capacitor tries to supply any instantaneous increase in load current from its stored energy. Using higher values of capacitance will enhance transient load performance as well as stability. Lowering the ESR of the capacitors will also improve the transient response to load current changes, but it will decrease stability.
Noise reduction
The noise reduction pin of the device is connected to the internal reference voltage node. Bypassing this pin to ground with a capacitor (0.01 F typical) will reduce the output voltage noise for demanding applications. This also improves the AC performance by increasing ripple rejection. In addition, bypassing the input pin to ground with a capacitor (0.1 F typical) will suppress input ripple form the power source.
Stability factors: Capacitance and ESR
The operating stability of linear regulators is determined by start-up delay, transient response to load currents, and stability of the feedback loop. The SA57001 has a fast transient loop response, with no built-in delay. Capacitors play an important part in compensating the regulator's output. A 4.7 F aluminum electrolytic capacitor is recommended for most applications, because they provide good performance with minimal cost. A tantalum capacitor can also be used. Tantalum
Thermal overload protection
When the junction temperature reaches approximately 150 C, the thermal sensor signals the shutdown logic to turn off the pass transistor. After the junction temperature has cooled to below the thermal threshold, plus the hysteresis, the sensor signals the shutdown logic to turn the pass transistor on again. This will create a pulsed output during lengthy thermal overloads. NOTE: Thermal overload protection is to protect the device during fault conditions. Do not exceed the maximum junction-temperature rating of Tj = +150 C during continuous operation.
VIN
5 THERMAL SHUTDOWN
4
VOUT
NOISE ON/OFF
3 1 300 k
400 k
GND
2
SL01419
Figure 22. Functional diagram.
2001 Aug 01
9
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
APPLICATION INFORMATION Power dissipation factors
The thermal performance of linear regulators depends on the following parameters: Maximum junction temperature (Tj) in C Maximum ambient temperature (Tamb) in C Power dissipation capability of the package in Watts (PD) Junction-to-ambient thermal resistance in C/W The Maximum Junction Temperature and Maximum Power Dissipation are both determined by the manufacturer's process and device's design. For the most part the ambient temperature is under the control of the user. The Maximum Ambient Temperature depends on the process used by the manufacturer. The package type and manufacturer's process determines Junction-to-Ambient Thermal Resistance. These parameters are related to each other as shown in the following equation: Tj = Tamb + ( PD x Rth(j-a) ) The term ( PD x Rth(j-a) ) represents the temperature rise from the ambient to the internal junction of the device.
Heat dissipation factors
Heat generated within the device is removed to the surrounding environment by radiation or conduction along several paths. In general, radiated heat is dissipated directly into the surrounding ambient from the chip package and leads. Conducted heat flows through an intermediate material, such as the leads or thermal grease, to circuit board traces and heat sinks in direct contact with the device's package or leads. The circuit board then radiates this heat to the ambient. For this reason, adequate airflow over the device and the circuit board is important. The SOT23-5 package is too small to easily use external heat sinks to increase the surface area and enhance the dissipation of generated heat. Heat dissipation must depend primarily on radiated heat into the surrounding environment and the heat flow through the leads into the printed circuit board. Some improvement can be realized by allowing additional exposed copper on the circuit board near the device to serve as heat absorbers and dissipaters for the device. The overall thermal resistance from junction to the surrounding ambient of the package (Rth(j-a)) is made up of three series elements and can be thought of as the total resistance of a series electrical circuit. These elements are: Rth(j-c) = Thermal resistance from Junction-to-Case Rth(c-s) = Thermal resistance from Case-to-heat Sink Rth(s-a) = Thermal resistance from heat Sink-to-Ambient Rth(j-a) is based primarily on the package type and the size of the silicon chip used in the device. The composition of package materials plays an important part. High heat conductivity materials produce reduced Junction-to-Case resistances. Rth(c-s) value is based on the package type, heat sink interface, and contact area of the device to the heat sink. The use of thermal grease or an insulator will increase the transfer of heat from the case to the heat sink. Rth(s-a), which is thermal resistance from heat sink to the ambient, is based on heat sink emissivity and airflow over the heat sink to carry the heat away. The heat sink to ambient heat flow is dependent on the ability of the surrounding ambient media to absorb the heat. The total Rth(j-a) thermal resistance is expressed as: Rth(j-a) = Rth(j-c) + Rth(c-s) + Rth(s-a) The maximum power that a given package can handle is given by: PD + T j(max) * T amb R th(j*a)
Power dissipation calculations
A regulator's maximum power dissipation can be determined by using the following equation: PD(max) = VIN(max)IG + [VIN(max) - VOUT(min)] IOUT(max) where: VIN(max) is the maximum input voltage IG is the maximum Ground Current at maximum output current VOUT(min) is the minimum output voltage IOUT(max) is the maximum output current (VIN(max)IG) represents heat generated in the device due to internal circuit biasing, leakage, etc. [VIN(max) - VOUT(min)] is the input-to-output voltage drop across the device due to the IOUT(max) current. When multiplied by IOUT(max), this represents heat generated in the device due to the output load current. Heat generated by the device represents lost energy (an inefficiency). The SA57001 device should not be operated under conditions that would cause a junction temperature of 150 C to be generated because the thermal shutdown protection circuit will shut down the device at or near this temperature.
2001 Aug 01
10
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
DEFINITIONS
Line regulation is the change in output voltage caused by a change in input line voltage. This parameter is measured using pulse measurement techniques or under conditions of low power dissipation so as to not significantly upset the thermal dynamics of the device during test. Load regulation is the change in output voltage caused by a change in output load current and is measured in a manner which will not cause significant heating of the device during test. Quiescent current is that current which flows to the ground pin of the device when the device is operated with no output current flowing. Ground current is that current which flows to the ground pin of the device when the device is operated with output current flowing due to an applied load. It is the measurement difference of input current minus the output current. Dropout voltage is the input/output differential voltage at which the regulator ceases to maintain specified output regulation if the input voltage is reduced. It is highly influenced by device junction temperature and load current. Output noise is the integrated output noise voltage specified over a frequency range and expressed in nV/kHz or Vrms. It is measured with the input voltage and output load current held constant during test. Current limiting is internal device circuitry incorporated to limit the output current of the device. This feature is incorporated in the device to protect the device against output over current conditions or output shorts to ground. Thermal shutdown is internal device circuitry incorporated in the device to shut down the device when the chip temperature reaches a specified temperature. This feature protects the device from excessive operating temperatures that would otherwise be catastrophic to the device. Over heating can be created by accidental output shorts.
TEST CIRCUITS AND TEST SET-UP TABLES
VIN 5 CIN 0.01 F (CERAMIC) 1 ON/OFF 2 GND CN 0.01 F 4 COUT 4.7 F (ALUMINUM, ELECTROLYTIC) VOUT
1.8 V to 12 V
SA57001-XX
NOISE 3
SL01420
Figure 23. Test circuit 1.
2001 Aug 01
11
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
PACKING METHOD
The SA57001-XX is packed in reels, as shown in Figure 24.
GUARD BAND
TAPE REEL ASSEMBLY
TAPE DETAIL
COVER TAPE
CARRIER TAPE
BARCODE LABEL
BOX
SL01305
Figure 24. Tape and reel packing method
2001 Aug 01
12
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
SOT23-5: plastic small outline package; 5 leads; body width 1.5 mm
1.35
1.2 1.0
0.025
0.55 0.41
0.22 0.08
3.00 2.70
1.70 1.50
0.55 0.35
2001 Aug 01
13
Philips Semiconductors
Product data
Microminiature, low power consumption, low dropout regulator
SA57001-XX
Data sheet status
Data sheet status [1] Objective data Preliminary data Product status [2] Development Qualification Definitions This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Product data
Production
[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 (c) Copyright Philips Electronics North America Corporation 2001 All rights reserved. Printed in U.S.A. Date of release: 08-01 Document order number: 9397 750 08717
Philips Semiconductors
2001 Aug 01 14

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